Interflux® Product file PacIFic 2010f

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	INTERFLUX® IF 2010F is a low solids VOC free, no-clean flux, its ingredients are designed to evaporate during the soldering process. Thus, making it very safe to use in high-reliability application circuits. PacIFic 2010F is designed for both spray and foam applications in wave soldering processes. With no rosin or resin to create a sticky residue, there are no contact problems, caused by post-solder flux residue. This halide free flux meets all Bellcore and IPC requirements. It provides great solderability on HAL, NiAU and OSP-coated PCB's. IF2005M also provides excellent solderability on lead free alloys. It has a longer life in the foam fluxer compared to synthetic fluxes, making it the most cost-effective choice for no clean soldering.

PacIFic 2010F can be applied by spray and foam fluxer systems, dipping, brush, flux pen, etc.

Wave soldering :

1.

2.

3.

PacIFic 2010F, when used in a foam fluxer system, is best passed over an air knife, mounted just behind the foam fluxer unit, to take away excessive flux. In spray fluxer units it only needs to be supplied for 30% of the amount of an low solids alcohol based flux.
Pre heating temperature range (top side board) 100°C - 160°C.
Wave contact times 2s - 5s

Density control :

	None needed - no thinner is required

appareance
density at 20°
solid content
j-std-004A class.
acid number

colourless
1.00g/ml
2,5 %
OR/ L0
16 mg KOH/g

documents

technical data sheet

safety data sheet

packaging

Interflux PacIFic 2010F is available in 1L, 10L, 25L and 200L containers